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Thanjavur: Building human resources for the semiconductor industry is key to the success of India’s semiconductor manufacturing growth story, CEO of Kaynes Semicon, Raghu Panicker, said in Thanjavur on Saturday.
Kaynes Semicon, Perspective Solutions & Sastra Deemed University, Thanjavur signed an MoU for semiconductor capacity building with a focus on advanced packaging at the university. The MoU shall lead to the establishment of Kaynes – Perceptives – Sastra Packaging Training Academy & QFN Prototype Line with Clean Room facility.
Panicker highlighted the growing market size for the global semiconductor packaging industry which is estimated at USD 47.22 billion in 2024 and expected to reach USD 79.37 billion by 2029, growing at a CAGR of 10.95%.
“India’s share in the global packaging industry is bound to increase with more advanced packaging facilities being established in India,” said Panicker. He urged graduates to keep themselves updated on the semiconductor learning curve experience.
Managing director of Perspectives Solutions, K Bhanupriya said that with wide ranging applications in consumer goods, automotive, industrial, electronics, high power computing, etc, trained manpower to fill the talent gap in semiconductor packaging technologies will be an asset for India’s demographic dividend
Vice-chancellor of Sastra S Vaidhyasubramaniam addressed the event.
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